Quality Policy

pic Full participation and pursuit of quality excellence
pic   Continuous improvement, casting industry boutique

Cultivate excellent talents, implement ISO9001:2015, IATF16949:2016, GJB9001C: 2017 standards, produce high-quality products, generate high efficiency and efficiency, and win customer satisfaction. Continuously improve the process and product quality, constantly innovate the product development and manufacturing technology, adhere to management innovation, ultimately exceed customer expectations, cast the industry's high-quality products, and make the company develop into an industry leader.


Organization Structure Of Quality Department

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Quality System

Microelectronics has established a sound quality system, and has successfully provided many customers with products that meet the corresponding quality requirements and expectations.

 

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Reliability Certification

Project No Test items Reference standards Test conditions A/R criterion
1 Temperature Coefficient of Resistance IEC 60115-1 4.8 At +25/-55℃ and +25/+125℃
Formula:T.C.R= [(R2-R1)/R1(t2-t1)]×10^6 (ppm/℃ )
Where :
t1=+25℃ or specified room temperature
t2=–55℃ or +125℃ test temperature R1=resistance at reference temperature in ohms
R2=resistance at test temperature in ohms
Reference specification
2 Thermal Shock IEC 60115-1 4.19 At –55 (+0/–10) ℃ for 30 minutes and at +125(+10/–0) ℃ for 30 minutes;100cycle ±(0.5%+0.05Ω)for1%tol
±(1.0%+0.05Ω)for5%tol
4 Short Time Overload IEC 60115-1 4.13 2.5×RCWV applied for 5 seconds at room temperature ±(1.0%+0.05Ω)for1%tol
±(2.0%+0.05Ω)for5%tol
No visible damage
5 Resistance to Soldering Heat IEC 60068-2-58 Unmounted chips; 260 ±5℃ for 10 ±1seconds ±(0.5%+0.05Ω)for1%tol
±(1.0%+0.05Ω)for5%tol
No visible damage
6 Life IEC 60115-1 4.25.1 At 70±2 °C for 1,000 hours; RCWV applied for 1.5 hours on and 0.5 hour off ±(1%+0.05Ω)for 1% tol
±(3%+0.05Ω) for 5% tol
7 Solderability IEC 60115-1 4.17 Solder bath at 245±3℃
Dipping time: 2±0.5 seconds
Well tinned (≥95% covered)
No visible damage
8 Humidity (steady state) IEC 60115-8 4.24.8 1,000 hours; 40±2℃; 93(+2/–3)% RH,RCWV applied for 1.5 hours on and 0.5 hour off ±(0.5%+0.05Ω)for1%tol
±(2.0%+0.05Ω)for5%tol
11 High Temperature Exposure at Upper Category Temperature IEC 60068-2-2 Unpowered chips at Upper Category Temperature for 1,000 hours ±(1.0%+0.05Ω)for1%tol
±2.0%+0.05Ω)for5%tol
<50 mΩ for Jumper
12 Insulation Resistance IEC 60115-1 4.6.1.1 Rated continuous overload voltage for 1 minute,100Vdc or Dielectric Withstand Voltage (Vrms) ≥10GΩ
13 Dielectric Withstand Voltage IEC 60115-1 4.6.1.1 Maximum voltage (Vrms) applied for 1 minute,No breakdown or flashover No breakdown or flashover
14 Bending Strength IEC 60115-1 4.15 Resistors mounted on a  glass epoxy resin PCB Bending:
0402/0603/0805/1206:3mm          1210/2512:2mm
Network Chip Resistor:1mm 
±(1.0%+0.05Ω)For1%,5% tol.
<50 mΩ for Jumper
No visible damage
15 Resistance to Solvent IEC 60115-1 4.29 Lsopropylalcohol(C3H7OH)or dichloromethane (CH2Cl2) followed by brushing No smeared
16 Noise IEC 60115-1 4.12 Maximum voltage (Vrms) applied. Resistors range Value
R < 100Ω 10 dB
100Ω ≤ R <1KΩ 20 dB
1KΩ ≤ R <10KΩ 30 dB
10KΩ ≤ R <100KΩ 40 dB
100KΩ ≤ R < 1MΩ 46 dB
1 MΩ ≤ R ≤ 22 MΩ 48 dB
17 Intermittent Overload IEC 60115-1 4.39 At room temperature; 2.5×RCWV applied for 1 second on and 25 seconds off; total 10,000 cycles ±(1.0%+0.05Ω)for1%tol
±(2.0%+0.05Ω)for5%tol
<100 mΩ for Jumper


Reliability Monitoring

Serial number StresS Stress test content Test conditions Number of samples Sampling frequency
1 Electrical parameter test In addition to applicable test standards, user standards all Quarterly
2 High temperature storage Test for 1000 hours, 125 ℃, no power, and measure within 24 ± 2 hours after the test. 77 Quarterly
3 Temperature cycle test Measure within 24 ± 2 hours after 1000 cycles (- 40 ℃ to 125 ℃). 77 Quarterly
4 Humidity bias test 1000 hours, 85 ℃, 85% relative humidity, apply rated VDD, and measure within 24 ± 2 hours after the test. 77 Quarterly
5 High temperature operation life test 1000 hours, 125 ℃, apply rated VDD. Measure within 24 ± 2 hours after the test. 77 Quarterly
6 Visual inspection Check the equipment structure, printing and process. Electrical test is not required all Quarterly
7 Physical size The physical specification describes the applicable equipment in detail. 30 Quarterly
8 Outgoing end strength (pin) Only the integrity of the lead is tested for the equipment with lead. Condition: A (227g) C (227g) 30 Quarterly
9 Solvent resistance test Test in 3 reagents according to the standard 5 Quarterly
10 Mechanical shock XYZ impact in three directions, half sine pulse, duration 0.5ms, peak acceleration 1500g 30 Quarterly
11 Vibration 5 grams, 20 minutes, 3 different directions, 12 cycles in each direction. 30 Quarterly
12 Resistance to welding heat Condition B, temperature 260 ℃± 5 ℃ 30 Quarterly
13 ESD electrostatic discharge test 6kV(DC)、12kV(AC)、16kV(AC)、25kV(AC) 15 Quarterly
14 Weldability There is no need to conduct electrical performance test for the lead wire and SMD. Zoom in on the 50X. condition.
With lead: method A, 235 ℃, catalog 3
SMD: a) Method B, 4 hrs, 155 ° C, dry heating 235 ° C
30 Quarterly
15 Electrical parameter characteristic experiment Refer to the requirements for the number of samples per LOT. The test records the maximum, minimum, average and indoor standard deviation, as well as the maximum and minimum operating temperature 30 Quarterly
16 Flame retardant test Acceptable UL94V-0 or V-1 20 Quarterly
17 Base plate bending (patch) Appendix 2 Note: minimum 2mm 30 Quarterly
18 Outgoing end strength (patch) Appendix 1 Note: Apply 1.8kg pressure to A for 60 seconds 30 Quarterly
19 Salt spray test 35 ℃± 2 ℃, 48 hours, NaCl 15% 30 Quarterly
20 total   648 /


Authentication

Military standard certificate

Military standard certificate

Quality management system certificate

Quality management system certificate

Quality management system certificate

Quality management system certificate